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Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
Specification CWT722-S
SSC
Drawn Approval
CUSTOMER
Approval
Rev. 02 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
CONTENTS
1. Feature & Application 2. Absolute Maximum Ratings 3. Electro Characteristics 4. Optical characteristics 5. Color & Binning 6. Rank of CWT722-S 7. Outline Dimension 8. Packing 9. Soldering 10. Precaution for use 11. Handling of Silicone Resin LEDs 12. Reliability Test Item and Condition
Rev. 02 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Technical Data Sheet
CWT722-S
Description This surface-mount LED comes in PLCC standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by epoxy or silicone. The package design coupled with careful selection of component materials allow these products to perform with high reliability in a larger temperature range -40 to 100. The high reliability feature is crucial to Automotive interior and Indoor ESS.
CWT722-S
Features
* White colored SMT package. * Material : InGaN/SiC * Encapsulating Resin : Silicon Resin * Suitable for all SMT assembly methods ; Suitable for all soldering methods * RoHS Compliant
Applications
* Interior automotive * Office Automation, Electrical Appliances, Industrial Equipment
Rev. 02 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
2. Absolute maximum ratings
Parameter Power Dissipation Forward Current Peak Forward Current Reverse Voltage (per die) Operating Temperature Storage Temperature Symbol Pd IF IFM
*2
Value 342 90 100 5 -40 ~ +85 -40 ~ +100
Unit mW mA mA V C C
VR Topr Tstg
*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW 1msec of pulse width and D 1/10 of duty ratio.
3. Electric & Optical characteristics
Parameter Forward Voltage (per die) Reverse Current (per die) Luminance Intensity Luminance Flux Color Temperature Color Coordinate Viewing Angle
*2 *1
Symbol VF IR IV V CCT X Y 21/2
Condition
IF =60 mA VR=5V IF =60 mA IF =60 mA IF =60 mA IF =60 mA IF =60 mA IF =60 mA IF =60 mA
Min 2.9 4700
Typ 3.2 4600 12.5 120 65 92
Max 3.6 10 5100 13.6 10000
Unit V A mcd lm K deg lm/W -
0.279 0.297
-
0.3531 0.3605
70 -
Optical Efficiency Color Rendering Index
op
Ra
*1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is 10% *2. 21/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC.
Rev. 02 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Forward Current [mA]
Relative Luminosity(a.u.)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
4. Optical characteristics
Forward Current vs. Forward Voltage (per die)
(Ta=25 OC )
10
1 2.0
2.5
3.0
3.5
4.0
Forward Voltage[V]
Relative Luminous Intensity vs Forward Current
(Ta=25 OC )
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0
0 15 30 45 60 75 90 105 120
Forward Current IF[mA]
Rev. 02 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Forward Current IF[mA]
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
4. Optical characteristics
Ambient Temperature vs. Allowable Forward Current (per die)
35 30 25 20 15 10 5 0
-25
0
25
50
O
75
100
Ambient temperature Ta( C)
Radiation Diagram
0 -30 30
(Ta=25 OC )
-60
60
-90
90
Rev. 02 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Relative Emission Intensity[a.u.]
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
4. Optical characteristics
Spectrum
(TA=25, IF=60mA)
1.0
0.8
0.6
0.4
0.2
0.0 300
400
500
600
700
800
Wavelength [nm]
Rev. 02 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
y
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
5. Color & Binning
0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.0
520525 515 530 535 540 510 545 550 555 505 560 565 570 500 575 580 585 590 495 595 600 490 610 620 630 830
485 480 475 470 460
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
x
Rev. 02 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Y
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
5. Color & Binning
0.40 0.38 0.36
6000K 5500K
5000K
g2 g1
f2 f1
0.34 0.32
9000K 7500K
6700K
e2 e1
d2 d1 c1
c2 b2 b1
0.30 0.28 0.26 0.27
0.28
0.29
0.30
0.31
0.32
0.33
0.34
0.35
0.36
X
COLOR RANK
9000K b1 0.2860 0.2920 0.3000 0.2950 d1 0.3065 0.3104 0.3190 0.3171 f1 0.3280 0.3286 0.3395 0.3400 0.3372 0.3168 0.3292 0.3500 0.3277 0.3280 0.3400 0.3400 0.3104 0.3030 0.2940 0.3065 0.3052 0.3171 0.3240 0.3150 5500K f2 0.3553 0.3372 0.3500 0.3680 0.3400 0.3395 0.3500 0.3531 0.2820 0.2790 0.2700 0.2860 0.2810 0.2950 0.2950 0.2890 6700K d2 0.3290 0.3104 0.3240 0.3420 0.3171 0.3190 0.3286 0.3280 g1 b2 0.2970 0.2820 0.2950 0.3120 0.2950 0.3000 0.3104 0.3065 e1 c1
7500K c2 0.2950 0.2890 0.2810 0.2950 0.2940 0.3065 0.3104 0.3030 6000K e2 0.3240 0.3150 0.3420 0.3240 0.3372 0.3553 g2 0.3500 0.3292 0.3400 0.3605 0.3400 0.3400 0.3531 0.3562 0.3680 0.3500 0.3605 0.3826
Rev. 02 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
0.3120 0.2950 0.3104 0.3290
0.3052 0.3171 0.3168 0.3280 0.3372 0.3277 5000K
* Measurement Uncertainty of the Color Coordinates : 0.01
Y
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
5. Color & Binning
0.40 0.38 0.36
6000K 5500K
5000K
4700K
5200K 5700K
0.34 0.32
9000K 7500K
6700K
6300K 7000K
0.30 0.28 0.26 0.27
8200K 10000K
0.28
0.29
0.30
0.31
0.32
0.33
0.34
0.35
0.36
X
Rev. 02 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
Rank Name L2 M2 N1 P2
6. Rank of CWT722-S
Rank Name Table X1 X2 X3
IV
Intensity value[mcd]
MIN MAX
CIE
VF
Forward Voltage [V] Rank Name Y3 MIN 2.9 3.0 3.1 3.2 3.3 3.4 3.5 MAX 3.0 3.1 3.2 3.3 3.4 3.5 3.6
3200 4200 5100 6200
4200 5100 6200 7600
CIE (Color Rank) Rank Name
9000K 7500K
Z1 Z2 Z3 A1
b1 c1 d1 e1 f1 g1
b2 c2 d2 e2 f2 g2
A2 A3
6700K 6000K 5500K 5000K
Available Rank
[Note] All measurements were made under the standardized environment of SSC. In order to ensure availability, single color rank will not be orderable.
Rev. 02 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
7.Outline Dimension
Package Outlines
6
5
4
Package Marking (Cathode)
Front View
1
2
3
Right View
Rear View
( Tolerance: 0.2, Unit: mm )
Circuit Diagram
Recommended Solder Pad
White Anode
6 5 4
W1
1
W2
2
W3
3
White Cathode
* MATERIALS PARTS Package Encapsulating Resin Electrodes MATERIALS Heat-Resistant Polymer Silicon Resin Ag Plating Copper Alloy
Rev. 02 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
8. Packing
Package Marking
( Tolerance: 0.2, Unit: mm )
1)Quantity : 700pcs/Reel 2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be 0.2mm 3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10 to the carrier tape 4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package
Rev. 02 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
Reel Packing Structure
Reel
QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR DESI PAK
Aluminum Vinyl Bag
QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B)) TYPE SIZE (mm) a c b 245 220 102 7inch 245 220 142
1 SIDE c
TUV
MADE IN KOREA
QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
Acriche
RoHS
1
Semiconductor EcoLight
b a
Rev. 02 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
9.Soldering
(1) Lead Solder
Lead Solder
Lead Solder Pre-heat Pre-heat time Peak-Temperature Soldering time Condition 120~150 120 sec. Max. 240 Max. 10 sec. Max.
2.5~5 o C / sec.
Pre-heating 120~150 oC
240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC
2.5~5 C / sec.
120sec. Max.
(2) Lead-Free Solder
Lead-frame Solder
Lead Free Solder Pre-heat Pre-heat time Peak-Temperature Soldering time Condition 150~200 120 sec. Max. 260 Max. 10 sec. Max.
1~5 oC / sec. Pre-heating 150~200 oC
260 o Max. C 10 sec. Max. 60sec. Max. Above 220 oC
1~5 oC / sec.
120sec. Max.
(3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315C under soldering iron.
(4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used.
Note : In case that the soldered products are reused in soldering process, we don't guarantee the products.
Rev. 02 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
10. Precaution for use
(1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5C ~30C Humidity : maximum 65%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; a. After opened and mounted the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40C Humidity : less than 30% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 605C. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (11) The LEDs must be soldered within seven days after opening the moisture-proof packing. (12) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (13) The appearance and specifications of the product may be modified for improvement without notice.
Rev. 02 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
11. Handling of Silicone Resin LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED's reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. Rev. 02 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
12. Reliability Test Item and Condition
Item Thermal Shock Temperature Cycle High Temperature Storage High Temperature High Humidity Storage Low Temperature Storage Operating Endurance Test High Temperature High Humidity Life Test High Temperature Life Test Low Temperature Life Test ESD(HBM) Reference EIAJ ED4701 EIAJ ED4701 EIAJ ED4701 EIAJ ED4701 EIAJ ED4701 Internal Reference Internal Reference Internal Reference Internal Reference MIL-STD883D Test Condition Ta =-40oC (30MIN) ~ 100oC (30MIN) Ta =-40oC (30MIN) ~ 25oC (5MIN) ~ 100oC (30MIN) ~ 25oC (5MIN) Ta =100oC Duration / Cycle 100 Cycle 100 Cycle 1000 Hours 1000 Hours 1000 Hours 1000 Hours 300 Hours 500 Hours 1000 Hours 3 Time Number of Damage 0/22 0/22
0/22
Ta =85oC, RH=85%
0/22
Ta =-40oC Ta =25oC, IF =20mA
0/22
0/22
Ta =85oC, RH=85%, IF =15mA
0/22
Ta =85oC, IF =20mA
0/22
Ta =-40oC, IF =20mA 1KV at 1.5k; 100pF
0/22 0/22
Criteria for Judging the Damage
Item Forward Voltage Reverse Current Luminous Intensity Symbol VF IR IV Condition IF =20mA VR=5V IF =20mA Criteria for Judgement MIN LSL*2 x 0.5 MAX USL*1 x 1.2 USL*1 x 2.0 -
Note : *1 USL : Upper Standard Level *2 LSL : Lower Standard Level
Rev. 02 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)

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